Publications

Accepted

[J4] Yapeng Li, Peng Xu, Mingzhen Li, Tsung-Yi Ho, Bei Yu, Tinghuan Chen, “Analog Circuit Representation Learning Informed by Kirchhoff’s Current Law”, accepted by IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD).

[J3] Peng Xu, Yapeng Li, Tinghuan Chen, Tsung-Yi Ho, Bei Yu, “Ckt2Vec: Efficient Electrical Encoding for Analog Circuit Representations in Vector Space”, accepted by IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD).

Journal

[J2] Yupeng Hu, Yapeng Li, Jindong Tu, Qi Sun, Cheng Zhuo, “Hierarchical Behavioral Learning-based Dynamic Electromigration Analysis for Signal Networks”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 44, no. 11, pp. 4433–4437, Nov. 2025.

[J1] Jindong Tu†, Yapeng Li†, Pengjia Li, Peng Xu, Qianru Zhang, Sanping Wan, Yongsheng Sun, Bei Yu, Tinghuan Chen, “SMART: Graph Learning-Boosted Subcircuit Matching for Large-Scale Analog Circuits”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 44, no. 10, pp. 4018–4031, 2025.

Conference

[C12] Pengjia Li, Shaoqian Zhou, Baohui Xie, Yapeng Li, Jindong Tu, Lingyi Zhang, Tinghuan Chen, “GFNBinding: Performance-driven High-level Synthesis Binding based on Multi-Objective GFlowNets”, IEEE International Conference on Computer Design (ICCD), Hong Kong, Nov. 16-18, 2026.

[C11] Yanfang Liu, Peng Xu, Yapeng Li, Mingjun Wang, Leilei Jin, Rongliang Fu, Tinghuan Chen, Wei Xing, Bei Yu, Tsung-Yi Ho, “MigSizer: Physical-aware Sizing Improving Analog/RF Circuit Migration”, IEEE International Conference on Computer Design (ICCD), Hong Kong, Nov. 16-18, 2026.

[C10] Jindong Tu, Junchen Liu, Liu Wang, Yapeng Li, Benyang Qi, Tongkai Wu, Zushuai Xie, Guoqing Li, Tinghuan Chen, “Hierarchical Adaptive Bayesian Optimization for Mixed-Variable Analog Circuit Design”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, Nov. 8-12, 2026.

[C9] Yapeng Li†, Beichen Li†, Pengjia Li, Tinghuan Chen, “Ignition: Irregular Board Boundary Aware PCB Migration”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, Nov. 8-12, 2026.

[C8] Yapeng Li†, Peng Xu†, Shixin Chen, Jindong Tu, Tongkai Wu, Chong Tong, Bei Yu, Tinghuan Chen, “AMigration: Analog placement Migration via Adaptive Constraints Relaxation”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, Nov. 8-12, 2026.

[C7] Shixin Chen, Peng Xu, Yapeng Li, Tinghuan Chen, Bei Yu, “PatchWork: A Patch-Driven Framework for Efficient Analog Layout Automation via Legacy Knowledge Reuse”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, Nov. 8-12, 2026.

[C6] Yapeng Li†, Peng Xu†, Mingzi Wang, Tinghuan Chen, “AlphaPlacer: Analog Placement Enhanced by Monte Carlo Tree Search”, ACM/IEEE Design Automation Conference (DAC), Long Beach, Jul. 26–29, 2026.

[C5] Peng Xu, Mingzi Wang, Yapeng Li, Yuyang Ye, Tinghuan Chen, Tsung-Yi Ho, Bei Yu, “DiffSP: Differentiable Sequence Pair-based Analog Placement”, ACM/IEEE Design Automation Conference (DAC), Long Beach, Jul. 26–29, 2026.

[C4] Tongkai Wu†, Beichen Li†, Yapeng Li, Zuxun Duan, Yanshi Liang, Yihe Wang, Baohui Xie, Qunsong Ye, Tinghuan Chen, “GRACE: A Ground Plane Generation and Re-routing Aware Co-design Engine”, ACM/IEEE Design Automation Conference (DAC), Long Beach, Jul. 26–29, 2026.

[C3] Shixin Chen, Peng Xu, Yapeng Li, Tinghuan Chen, Bei Yu, “IP-Matcher: An Efficient One-to-Many Matching Framework for Analog Circuit Design and Reusing”, IEEE/ACM Proceedings Design, Automation and Test in Europe (DATE), Verona, Apr. 20–22, 2026.

[C2] Peng Xu†, Yapeng Li†, Tinghuan Chen, Tsung-Yi Ho, Bei Yu, “KCLNet: Electrically Equivalence-Oriented Graph Representation Learning for Analog Circuits”, AAAI Conference on Artificial Intelligence (AAAI), Singapore, Feb. 20–27, 2026.

[C1] Jindong Tu, Yapeng Li, Peng Xu, Tuo Li, Guoqing Li, Zushuai Xie, Bei Yu, Tinghuan Chen, “RSizing: Robust Bayesian Optimization for Analog Circuit Sizing Under Process Variations”, IEEE/ACM International Conference on Computer-Aided Design (ICCAD), Munich, Oct. 26–30, 2025.

† denotes co-first author / equal contribution

Patents

[P1] Tinghuan Chen, Jindong Tu, Yapeng Li, Yue Zheng, Yaojing Zhang, “一种面向工艺偏差的模拟电路参数优化方法”, CN120493847B, 2025.